High current (max. 600 mA)
Low voltage (max. 40 V)
AEC-Q101 qualified
1+:¥1.0370
100+:¥0.5635
300+:¥0.5635
High current (max. 600 mA)
Low voltage (max. 40V)
Leadless ultra small SMD plastic package
Low package height of 0.50 mm
Power dissipation comparable to SOT23
1+:¥1.1543
100+:¥0.4368
300+:¥0.4367
High current
Three current gain selections
AEC-Q101 qualified
1+:¥0.7729
100+:¥0.4882
300+:¥0.4882
300 mW total power dissipation
Very small 1.6 mm x 1.2 mm ultra thin package
Replaces two SC-75/SC-89 packaged transistors on same PCB area
Reduced required PCB area
Reduced pick and place costs
1+:¥2.2617
100+:¥0.9577
300+:¥0.9577
Low current (max. 100 mA)
Low voltage (max. 65 V)
1+:¥0.6887
100+:¥0.2413
300+:¥0.2413
300 mW total power dissipation
Very small 1.6 mm x 1.2 mm x 0.55 mm ultra thin package
Excellent coplanarity due to straight leads
Low collector capacitance
Improved thermal behaviour due to flat leads
Reduces number of components as replacement of two SC-75/SC-89 packaged BISS transistors
Reduces required board space
Reduces pick and place costs
1+:¥2.4086
100+:¥1.4594
300+:¥1.4594
High current (max. 600 mA)
Low voltage (max. 40V)
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Power dissipation comparable to SOT23
1+:¥1.3899
100+:¥0.6995
300+:¥0.6995
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High efficiency leading to reduced heat generation
Reduced printed-circuit board requirements.
AEC-Q101 qualified
1+:¥2.1018
100+:¥0.7978
300+:¥0.7978
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High efficiency leading to reduced heat generation
Reduced printed-circuit board requirements.
AEC-Q101 qualified
1+:¥2.1018
100+:¥0.7978
300+:¥0.7978
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
Exposed heat sink for excellent thermal and electrical conductivity
Leadless small SMD plastic package with medium power capability
1+:¥3.1996
100+:¥2.3747
300+:¥1.8436
Low collector-emitter saturation voltage
High current capability
Improved device reliability due to reduced heat generation
1+:¥2.3295
100+:¥1.0639
300+:¥1.0639
High voltage
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
Small SMD plastic package
1+:¥2.4086
100+:¥1.2221
300+:¥1.2221
High voltage
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
Small SMD plastic package
1+:¥2.7024
100+:¥1.4255
300+:¥1.4255
Leadless ultra small SMD plastic package
Reduces component count
Reduces pick and place costs
Low package height of 0.5 mm
1+:¥1.9662
100+:¥0.9277
300+:¥0.9277
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Suitable for Automatic Optical Inspection (AOI) of solder joint
Power dissipation comparable to SOT23
1+:¥1.5255
100+:¥0.6995
300+:¥0.6995
High current (max. 600 mA)
Low voltage (max. 40V)
Leadless ultra small SMD plastic package
Low package height of 0.37 mm
Suitable for Automatic Optical Inspection (AOI) of solder joint
1+:¥1.8645
100+:¥0.7729
300+:¥0.7729