Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 8 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.7986
100+:¥2.6252
300+:¥2.1976
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 6 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.7787
100+:¥2.6352
300+:¥2.0584
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 2 A (per diode)
Switching time: trr ≤ 25 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.1622
100+:¥2.3170
300+:¥1.8794
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 10 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.3654
100+:¥3.0230
300+:¥2.5258
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 2 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥1.2600
100+:¥0.8800
300+:¥1.3922
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥2.4959
100+:¥1.4916
300+:¥1.3922
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 3 A
Switching time trr ≤ 30 ns
Pt doped life time control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥2.5556
100+:¥1.7501
300+:¥1.3922
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥1.9291
100+:¥1.2430
300+:¥1.1336
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Low forward voltage
Pt doped lifetime control
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
1+:¥2.2871
100+:¥1.3723
300+:¥1.2629
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 1 A
Hyperfast recovery time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥1.6507
100+:¥1.3623
300+:¥1.1038
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 3 A
Typical switching time trr of 41 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥3.0826
100+:¥2.1479
300+:¥1.6706
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q qualified
1+:¥2.1777
100+:¥1.4220
300+:¥1.2828
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥2.3269
100+:¥1.3922
300+:¥1.2927
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.9521
100+:¥3.9279
300+:¥3.3312
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 3 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.4847
100+:¥3.2318
300+:¥2.7147
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥4.0391
100+:¥2.8892
300+:¥2.4079
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥2.8241
100+:¥1.9590
300+:¥1.5314
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.4705
100+:¥2.4164
300+:¥1.8894
新品
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 1 A
Hyperfast recovery time: trr ≤ 25 ns
Planar die design with Pt doped life time control
Low inductance
Small and flat lead SMD plastic package, typical height 0.68 mm
High power capability due to clip-bond technology
1+:¥2.4064
100+:¥1.2132
300+:¥1.2132
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥5.4394
100+:¥4.2361
300+:¥3.6594