Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 8 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.3166
100+:¥2.9832
300+:¥2.4973
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 6 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.2940
100+:¥2.9945
300+:¥2.3391
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 3 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥5.0963
100+:¥3.6725
300+:¥3.0849
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 2 A (per diode)
Switching time: trr ≤ 25 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.5934
100+:¥2.6329
300+:¥2.1357
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥6.1811
100+:¥4.8138
300+:¥4.1584
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 10 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥4.9607
100+:¥3.4352
300+:¥2.8702
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 2 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥2.9154
100+:¥2.0340
300+:¥1.5820
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥2.6442
100+:¥1.5820
300+:¥1.4690
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 1 A
Typical switching time trr of 35 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥2.8363
100+:¥1.6950
300+:¥1.5820
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 3 A
Switching time trr ≤ 30 ns
Pt doped life time control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥2.9041
100+:¥1.9888
300+:¥1.5820
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥2.1922
100+:¥1.4125
300+:¥1.2882
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q qualified
1+:¥2.4747
100+:¥1.6159
300+:¥1.4577
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 2 A
Switching time trr ≤ 25 ns
Low forward voltage
Pt doped lifetime control
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
1+:¥2.5990
100+:¥1.5594
300+:¥1.4351
Reverse voltage VR ≤ 200 V
Forward current IF ≤ 1 A
Hyperfast recovery time trr ≤ 25 ns
Pt doped lifetime control
Low inductance
Small and flat lead SMD plastic package
Package height typ. 1 mm
High power capability due to clip-bond technology
Planar die design
Capable for reflow and wave soldering
AEC-Q101 qualified
1+:¥1.8758
100+:¥1.5481
300+:¥1.2543
新品
Reverse voltage VR ≤ 650 V
Forward current IF ≤ 3 A
Typical switching time trr of 41 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
Planar die design
1+:¥3.5030
100+:¥2.4408
300+:¥1.8984
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A (per diode)
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥5.6274
100+:¥4.4635
300+:¥3.7855
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 5 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥4.5899
100+:¥3.2832
300+:¥2.7362
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Planar die design
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
High power capability due to clip-bond technology
1+:¥3.2092
100+:¥2.2261
300+:¥1.7402
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 4 A
Switching time: trr ≤ 30 ns
Pt doped life time control
Low inductance
Power and flat lead SMD plastic package
Package height typical 0.95 mm
High power capability due to clip-bond technology
Planar die design
1+:¥3.9437
100+:¥2.7459
300+:¥2.1470
新品
Reverse voltage: VR ≤ 200 V
Forward current: IF ≤ 1 A
Hyperfast recovery time: trr ≤ 25 ns
Planar die design with Pt doped life time control
Low inductance
Small and flat lead SMD plastic package, typical height 0.68 mm
High power capability due to clip-bond technology
1+:¥2.7346
100+:¥1.3786
300+:¥1.3786