Very low forward voltage
Guard ring protected
Ultra small SMD package
1+:¥1.4019
100+:¥0.6854
300+:¥0.5716
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 450 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥1.6124
100+:¥0.6061
300+:¥0.6061
Ultra high-speed switching
Very low forward voltage
Guard-ring protected
Very small SMD plastic package
1+:¥1.3565
100+:¥0.6835
300+:¥0.6055
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage, typical: VF = 435 mV
Low reverse current, typical: IR = 325 µA
Package height typ. 270 µm
1+:¥1.7616
100+:¥0.6777
300+:¥0.6777
Average forward current: IF(AV) ≤ 2 A
Reverse voltage: VR ≤ 100 V
Low forward voltage: VF = 710 mV
High power capability due to clip-bonding technology
Extremely low leakage current
High temperature Tj ≤ 175 °C
Small and flat lead SMD plastic package
1+:¥2.4263
100+:¥1.4717
300+:¥1.3126
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
1+:¥2.0584
100+:¥1.1933
300+:¥1.0143
Forward current: IF ≤ 1 A
Reverse voltage: VR ≤ 60 V
Very low forward voltage
Small and flat lead SMD plastic package
1+:¥1.8411
100+:¥0.8786
300+:¥0.8786
Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 30 V
Low forward voltage typ. VF = 380 mV
Low reverse current typ. IR = 40 µA
Small SMD plastic package
1+:¥1.5627
100+:¥0.5852
300+:¥0.5852
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
1+:¥2.0882
100+:¥1.3325
300+:¥1.2231
High switching speed
Low leakage current
High breakdown voltage
Low capacitance
1+:¥2.0500
100+:¥1.1948
300+:¥1.1053
Low forward voltage
Low capacitance
1+:¥0.7931
100+:¥0.3128
300+:¥0.3128
Forward current: ≤ 0.2 A
Reverse voltage: ≤ 30 V
Very low forward voltage
Ultra small and flat lead SMD plastic package
1+:¥2.0002
100+:¥1.1550
300+:¥1.0655
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Small and flat lead SMD power plastic package
1+:¥5.1227
100+:¥4.0487
300+:¥3.4522
Low forward voltage
Low capacitance
1+:¥0.8522
100+:¥0.5012
300+:¥0.3938
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
Low leakage current due to Trench MEGA Schottky technology
High power capability due to clip-bonding technology
Small and flat lead SMD plastic package
Suitable for both reflow and wave soldering
1+:¥2.2772
100+:¥1.3723
300+:¥1.2629
Forward current: IF ≤ 0.5 A
Reverse voltage: VR ≤ 30 V
Very low forward voltage
Ultra small SMD plastic package
1+:¥1.9590
100+:¥1.2231
300+:¥1.1038
Forward current: IF ≤ 1 A
Reverse voltage VR ≤ 60 V
Low forward voltage, typ. VF = 570 mV
Low reverse current, typ. IR = 11 µA
Small SMD plastic package
1+:¥1.8496
100+:¥0.7657
300+:¥0.7657
Average forward current: IF(AV) ≤ 1 A
Reverse voltage: VR ≤ 60 V
Low forward voltage, typical: VF = 525 mV
Low reverse current, typical: IR = 185 µA
Package height typ. 270 µm
1+:¥2.1081
100+:¥0.8094
300+:¥0.8094