Bidirectional ESD protection of one line
Ultra low capacitance: Cd < 0.3 pF
ESD protection starting from 15 kV (IEC 61000-4-2; ISO 10605)
Deep snap-back combined with dynamic resistance of 0.35 Ohm
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.6296
100+:¥0.5037
300+:¥0.5038
Ultra low diode capacitance Cd = 0.28 pF
High reverse standoff voltage VRWM = 32 V
Very small voltage dependency of the capacitance
ESD protection up to ±10 kV according to IEC 61000-4-2, level 4
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.6103
100+:¥1.3221
300+:¥1.3221
Ultra low diode capacitance Cd = 0.28 pF
High reverse standoff voltage VRWM = 30 V
Very small voltage dependency of the capacitance
ESD protection up to ±10 kV according to IEC 61000-4-2, level 4
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.5560
100+:¥1.2897
300+:¥1.2897
Ultra low diode capacitance Cd = 0.28 pF
High reverse standoff voltage VRWM = 24 V
Very small voltage dependency of the capacitance
ESD protection up to ±10 kV according to IEC 61000-4-2, level 4
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.6844
100+:¥0.5475
300+:¥0.5475
Ultra low diode capacitance Cd = 0.31 pF
High reverse standoff voltage VRWM = 18 V
Very small voltage dependency of the capacitance
ESD protection up to ±10 kV according to IEC 61000-4-2, level 4
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.4070
100+:¥1.2150
300+:¥1.2150
Unidirectional ESD protection of one line
Ultra low capacitance: Cd < 0.6 pF
ESD protection starting from 15 kV (IEC 61000-4-2; ISO 10605)
Deep snap-back combined with dynamic resistance of 0.3 Ohm
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥0.6296
100+:¥0.5037
300+:¥0.5038
ESD protection of one line
Ultra small SMD plastic package
ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPP = 10.4 A
Ultra low leakage current: IRM typ. 60 nA
1+:¥0.3468
100+:¥0.2067
300+:¥0.2067
Bidirectional ESD protection of one line
High reverse standoff voltage VRWM = 24 V
Ultra-low diode capacitance Cd = 0.28 pF
Ultra small plastic package 1.0 x 0.6 x 0.48 mm
ESD protection up to ±10 kV contact discharge according to IEC 61000-4-2
1+:¥0.4836
100+:¥0.3125
300+:¥0.3124
Bidirectional ESD protection of one line
Extremely high surge robustness of 5.5 A 8/20 µs
Extremely low diode capacitance Cd = 0.45 pF max
Extremely low clamping voltage to protect sensitive I/Os
Extremely low-inductance protection path to ground
ESD protection up to ±15 kV according to IEC 61000-4-2
Ultra small SMD package
1+:¥1.9750
100+:¥0.9968
300+:¥0.9968
Bidirectional ESD protection of one line
Extremely low diode capacitance, Cd = 0.1 pF at 10 GHz
Extremely low clamping voltage to protect sensitive transceivers
Extremely low leakage current < 1 nA at 5 V
Extremely low inductance protection path to ground
Very high surge robustness: 4.8 A for 8/20 µs pulse
Extremely low insertion loss: -0.28 dB at 10 GHz
Extremely low return loss: -19 dB at 10 GHz
20 Gbps capable
Ultra-small SMD package
1+:¥1.4125
100+:¥0.6916
300+:¥0.6916
Bidirectional ESD protection of one line
Extremely low diode capacitance Cd = 0.08 pF
Extremely low insertion loss αIL = -0.19 dB at 10 GHz
Extremely low return loss αRL = -23.5 dB at 10 GHz
Low clamping voltage to protect sensitive I/Os
Extremely low inductance protection path to ground
Ultra small SMD package
1+:¥1.7063
100+:¥0.9029
300+:¥0.5944
Bidirectional ESD protection of one line
Extremely low diode capacitance, Cd = 0.085 pF at 10 GHz
Extremely low insertion loss: -0.25 dB at 10 GHz
Extremely low return loss: -19.4 dB at 10 GHz
Extremely low clamping voltage to protect sensitive transceivers
Extremely low leakage current < 1 nA at 5 V
Extremely low inductance protection path to ground
20 Gbps capable
Ultra-small SMD package
1+:¥1.7063
100+:¥0.9029
300+:¥0.5944
Bidirectional ESD protection of one line
Ultra small leadless package with a height of 0.3 mm
IEC 61000-4-5 (surge): IPP = 24 A peak pulse (average measured)
Very low clamping voltage: VCL = 4.8 V typical at 16 A for a TLP pulse
Ultra low leakage current: IRM = 1 nA (average measured)
ESD protection up to 30 kV
1+:¥0.8883
100+:¥0.6883
300+:¥0.6883
Low threshold voltage
Very fast switching
Trench MOSFET technology
ElectroStatic Discharge (ESD) protection typically > 2 kV HBM
1+:¥2.4521
100+:¥1.5255
300+:¥1.5255
Low threshold voltage
Very fast switching
Trench MOSFET technology
ElectroStatic Discharge (ESD) protection typically > 2 kV HBM
1+:¥2.3730
100+:¥1.4803
300+:¥1.4803
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
1+:¥2.4182
100+:¥1.2204
300+:¥1.2204
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.5425
100+:¥1.2882
300+:¥1.2882
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
1+:¥2.2939
100+:¥1.1526
300+:¥1.1526
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.4069
100+:¥1.2091
300+:¥1.2091
Low forward voltage
Low Qrr and low IRM
Low leakage current
High power capability due to clip-bonding technology
Power flat lead plastic package with exposed heatsink for optimal thermal connection
Qualified according to AEC-Q101 and recommended for use in automotive applications
1+:¥2.4980
100+:¥1.2615
300+:¥1.2615